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High Precision Advanced Packaging Solder Head Module Design and Development - SJTU Global Project

Company: SBT Ultrasonic Technology Co., Ltd.

Major(s):
Primary: ME
Secondary: IE

Non-Disclosure Agreement: NO

Intellectual Property: NO

Advanced packaging technology aligns with the trend of high-end chips evolving towards smaller sizes, higher performance, and lower power consumption. As Moore's Law gradually slows down, driven by new technologies such as Chiplet and HBM, advanced packaging becomes increasingly important. In the post-Moore's Law era, the focus of semiconductor industry development shifts from further improving wafer manufacturing technology nodes to packaging technology innovation. Advanced packaging has become a crucial path to counteract the physical limitations posed by the slowdown of Moore's Law. The growing demand for advanced packaging has made advanced packaging equipment highly valued and prioritized, with capital expenditure increasing year by year and a huge market capacity for equipment. One of the most critical core components of advanced packaging is the solder head module. It requires Z+ rotation ? and horizontal adjustment, equipped with precise force control and temperature control. Not only does it need to utilize advanced motion control, vibration design and control, precision drive mechanisms, and high-performance materials, but it also faces constraints in space and quality, making its realization a significant challenge.