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Electronic Chip Depackager

Company: Penn State University

Major(s):
Primary: ME
Secondary: EE
Optional: IE

Non-Disclosure Agreement: NO

Intellectual Property: NO

Commercially available electronic chips come packaged with polymeric or ceramic coating or lids. The goal is to remove a small portion of the top or bottom lid so that we can examine the interior and make specimens for microscopic or spectroscopic studies. A picture showing lidded and delidded chips. Note that this specific delidding did not involve microdrilling - but probably microgrinding The lid can be as thin as 1 mm, and we need to remove materials size of 5 mm in diameter. I envision the machine tool as a micro drill with a specimen stage with 1 micron resolution in the hole depth direction. This can be achieved using a piezo positioning stage. The tool can be augmented with a stereomicroscope so that the operator can see when to stop.