Project Details

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AI-assisted Mold Changeover System

Company: TE Connectivity

Major(s):
Primary: CMPSC
Secondary: IE

Non-Disclosure Agreement: YES

Intellectual Property: YES

The TE AI Cup is a global competition where TE Connectivity partners with university teams to tackle real-world industrial AI challenges in manufacturing environments. Students selecting this project are expected to meet regularly during the Spring semester (approximately bi-weekly) and virtually participate in the AI Cup Final Competition in May, presenting their solutions alongside teams from around the world. Winning teams may receive scholarship of up to $6,500, along with internship or full-time opportunities at TE Connectivity. To improve TE Connectivity’s mold injection changeover workflow, an automated changeover guidebook generation can be implemented to eliminate the need for an engineer to manually update guidebooks every time products are updated or introduced. 2D mold drawings contain specific PN and positioning information that can be read with AI technologies, to be used as derive what parts need to be changed during a mold changeover. Alongside the drawings, the 3D model files can be used to extract some hierarchical features or other finer details. With this structured data, updated changeover guidebooks and an interface can be created for engineers to retrieve the required change over guide.